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As the ICT industry prepare for the biggest technology showcase in Asia, AKA COMPUTEX TAIWAN 2016, many key vendors are now hinting as to what they have in store for the coming event. Intel, as usual, had been one of the first to show off what it is planning for its upcoming Apollo Lake.

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Based on the materials it just revealed at the recently concluded Intel Developer Forum Shenzen 2016 (IDF Shenzen 2016), the globally renowned chipmaker formally introduce the Intel Apollo Lake platform for next-gen System-on-Chip (SoC) powered devices. Beyond enhanced computing capabilities, the new concept will sport new graphics processing, enhanced battery life control, and advance ultra-sleek chassis design.

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According to Anandtech, the Apollo Lake SoC processor, based on the new Goldmont microarchitecture, will run on a similar graphics core that the present Intel Skylake CPUs are now using, feature support for DDR4, DDR3L, and LPDDR3/4 RAM, pack in 4K decoding capabilities that include HEVC and VP9 codec integration, and even offer PCIe x4, eMMC 5.0, and USB Type-C capabilities. Just so it is legacy compliant, the new Intel SoC is compatible with traditional SATA storage drives and current wireless technologies.

Based on what had been shown at IDF Shenzen 2016, it has been confirmed that the Goldmont empowered next-gen SoC is legacy ready as it will be loaded out onto current mobile platforms. Anandtech believes that there will be two variant Apollo Lake designs – Quad-Core configuration for consumer devices and an Octa-Core concept for smart devices and embedded systems.

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Given that the new SoC uses the next-gen Goldmont microarchitecture, many alterations to make the platform smaller and thinner yet retain next level performance gains have also been developed. Multiple designs that tap onto optional features, such as the LTE modem and additional storage mode offerings, are now being considered and have become one of the driving messages for Intel from here on out.

The culmination of the Apollo Lake reveal is the introduction of Intel’s vision for next-gen entry level notebooks – the Cloudbook. This ultra-light and ultra-compact mobile computing platforms, many of which are expected to be 18mm in thickness or less, will not exactly a real push-over as they will pack in 2GB RAM, 32GB of storage, and over eight hours of battery life. The same mindset is also being considered for 2-in-1 platforms.

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More details, like the TDP and power output for Apollo Lake, will be unveiled at the end of May 2016 when COMPUTEX TAIWAN 2016 commences.

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